Double-Sided Conductive Fabric Tape

Short Description:

Property Standard Value Test Method
Color Gray /
Thickness (mm) 0.08 ± 0.01 Thickness Gauge
Width (mm) Customizable /
Peel Strength (gf/inch) ≥ 800 180° Peel Tester
Holding Power (Hr) ≥ 48 Holding Power Tester
Temperature Resistance (°C) 80 /
Initial Tack (Ball No. #) ≥ 5 Tack Rolling Ball Tester
Surface Resistance (MΩ) ≤ 50 Resistance Tester
Flame Retardancy Non-Flame Retardant Flame Retardant Tester

Product Detail

Double-Sided Conductive Fabric Tape – High EMI Shielding & Grounding Performance

Our double-sided conductive fabric tape is designed for advanced electromagnetic interference (EMI) shielding and reliable electrical grounding. Constructed from a plain-weave conductive fabric with a high-conductivity metal coating, it is laminated with conductive acrylic adhesive on both sides. This tape ensures excellent shielding effectiveness, strong adhesion, and outstanding flexibility for high-precision electronic applications.

Key Features

  • Superior EMI Shielding: Effectively blocks electromagnetic and radio frequency interference (EMI/RFI).

  • Double-Sided Conductivity: Both the fabric and adhesive layers conduct electricity, providing consistent grounding.

  • Flexible and Durable: Excellent conformability, abrasion resistance, and long-term performance under stress or heat.

  • Strong Adhesion: High bonding strength to metals, plastics, and polyimide substrates.

  • Customizable: Available in various widths, thicknesses, and roll lengths to suit your application.

Technical Specifications

  • Color: Gray

  • Thickness: 0.08 ± 0.01 mm

  • Width: 1270 mm

  • Peel Strength: ≥800 gf/inch

  • Holding Power: ≥48 hours

  • Temperature Resistance: Up to 80°C

  • Initial Tack: ≥5 (Ball No. #)

  • Surface Resistance: ≤50 MΩ

  • Flame Retardancy: Non-flame retardant

Applications

This double-sided EMI shielding tape is ideal for:

  • Electronic device internal structures (FFC, PCB, antennas, speakers, cameras)

  • ESD grounding paths in smartphones, tablets, and laptops

  • Shielding and bonding of PU foam, metal housings, or enclosures

  • Custom die-cut components for IT, telecom, and medical electronics

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